DocumentCode :
2604833
Title :
Principles of Corrosion
Author :
Kolesar, Stephen C.
Author_Institution :
Materials Characterization Laboratory, Texas Instruments, Inc., Dallas, Texas 75222
fYear :
1974
fDate :
27120
Firstpage :
155
Lastpage :
167
Abstract :
The principles of corrosion have been reviewed from two aspects: Thermodynamics and kinetics. Thermodynamic considerations yield the relative corrosion tendencies ofthe elements. Three types of corrosion cells have also been mentioned: Galvanic, concentration and simple anodic. Kinetics attempts to explain and predict the actual corrosion behavior of materials. The relative corrosion tendencies, the metallurgical aspects and the environmental conditions must all ´be considered. The environmental conditions of interest are normally temperature, relative humidity, applied electrical bias and ionic contamination. Examples of practical corrosion problems have been discussed. Corrosion is a difficult subject because each case is highly specific. Corrosion of IC devices is even more difficult because of the small sizes of components and because the local corrosion conditions within the IC packages are unknown Several examples of metallization corrosion have been briefly described, such as Mo-Au (galvanic), Al and NiCr (simple anodic), and Al in the presence of phosphorus and chlorine(ionic contamination). The function of failure analysis laboratories is to identify the corrosion mechanism and the Mfaterial causing corrosion. Then that source of corrosion must be related back to the device processing and fabrication stages in order to prevent future problems. There are two approaches to preventing corrosion failures: (1) Protect corrosion susceptible materials from the corrosive environment, as in applying oxide and nitride passivation coatinqs and in packaging finished devices in plas tic or hermetically sealed containers; (2) utilize corrosion resistant systems, such-as the (thus far suecesssful) .Ti/W/Au system.
Keywords :
Contamination; Corrosion; Failure analysis; Galvanizing; Humidity; Integrated circuit packaging; Kinetic theory; Metallization; Temperature; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1974. 12th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1974.362642
Filename :
4208020
Link To Document :
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