• DocumentCode
    2604955
  • Title

    "Silver Plated Lead Frames" for Large Molded Packages

  • Author

    Flaskerud, Paul ; Mann, Rick

  • Author_Institution
    Electronic Arrays, Inc., Mountain View, California
  • fYear
    1974
  • fDate
    27120
  • Firstpage
    211
  • Lastpage
    222
  • Abstract
    The use of gold in integrated circuit packages has become prohibitive because of cost. Of the current alternatives available, silver plating offers a favorable economic advantage to the MOS-LSI manufacturer. This paper discusses the economics of various gold substitute systems. In addition, the paper presents data which demonstrates the reliability of molded packages using silver plated lead frames. Reliability data on Life, Temperature Cycling, 85°C/85% R.H. and Solderability Testing is presented. Silver plating is an economical and reliable system for use in molded packages for MOS-LSI devices.
  • Keywords
    Bonding; Consumer electronics; Costs; Electronics packaging; Fingers; Gold; Integrated circuit packaging; Lead; Semiconductor device packaging; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1974. 12th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1974.362649
  • Filename
    4208027
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2604955