• DocumentCode
    2604977
  • Title

    "The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits"

  • Author

    Pietrucha, Bernard M. ; Reiss, Eugene M.

  • Author_Institution
    RCA Solid State Division, Rt. 202, Somerville, N.J.
  • fYear
    1974
  • fDate
    27120
  • Firstpage
    234
  • Lastpage
    238
  • Abstract
    The implementation and advantages of epoxy die-attach are described with special emphasis given to areas of mechanical integrity and product stability. A recent special test program indicates that the epoxy die-attach process results in reliable product.
  • Keywords
    Analog integrated circuits; Integrated circuit reliability; Manufacturing; Microassembly; Packaging; Silver; Stress; Temperature; Testing; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1974. 12th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1974.362651
  • Filename
    4208029
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2604977