مرکز منطقه ای اطلاع رساني علوم و فناوري - Miniature Moisture Sensors for In-Package Use by the Microelectronics Industry

DocumentCode :

2605398

Title :

Miniature Moisture Sensors for In-Package Use by the Microelectronics Industry

Author :

Meyer, Donald E.

Author_Institution :

Texas Instruments Incorporated, P.O. Box 5012, MS 46, Dallas, Texas 75222; Endurex Corporation, P.O. Box 11154, Dallas, Texas 75223. (214) 238-2472

fYear :

1975

fDate :

27485

Firstpage :

Lastpage :

Keywords :

Atmosphere; Failure analysis; Instruments; Manufacturing; Mass spectroscopy; Microelectronics; Moisture; Packaging; Sampling methods; Testing;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Reliability Physics Symposium, 1975. 13th Annual

Conference_Location :

Las Vegas, NV, USA

ISSN :

0735-0791

Type :

conf

DOI :

10.1109/IRPS.1975.362675

Filename :

4208056

Link To Document :