Title :
Susceptibility of Microweids in Hybrid Microcincuits to Corrosion Degradation
Author_Institution :
Sandia Laboratories, Albuquerque, New Mexico 87115
Abstract :
Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.
Keywords :
Aluminum; Capacitors; Circuit testing; Conducting materials; Corrosion; Degradation; Electrons; Production; Silver; Wires;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362678