• DocumentCode
    2605448
  • Title

    Susceptibility of Microweids in Hybrid Microcincuits to Corrosion Degradation

  • Author

    Jellison, J.L.

  • Author_Institution
    Sandia Laboratories, Albuquerque, New Mexico 87115
  • fYear
    1975
  • fDate
    27485
  • Firstpage
    70
  • Lastpage
    79
  • Abstract
    Analysis of broken ultrasonic Al-Ag bonds involving SEM electron microprobe, ion microprobe, and Auger electron spectroscopy indicated that failure was due to corrosion. Subsequent environmental tests demonstrated that Al-Ag bonds are highly susceptible to corrosion, but Al-Au and Au-Al bonds are less so. No evidence of corrosion of Au-Ag bonds was found.
  • Keywords
    Aluminum; Capacitors; Circuit testing; Conducting materials; Corrosion; Degradation; Electrons; Production; Silver; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1975. 13th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1975.362678
  • Filename
    4208059