DocumentCode
2605630
Title
Width Dependence of Electromigration Life in Al-Cu Al-Cu-Si, and Ag Conductors
Author
Scoggan, G.A. ; Agarwala, B.N. ; Peressini, P.P. ; Brouillard, A.
Author_Institution
IBM System Products Division, East Fishkill, Hopewell Junction, New York 12533
fYear
1975
fDate
27485
Firstpage
151
Lastpage
158
Abstract
The electromigration lifetimes of thin-film Al-Cu, Al-Cu-Si, and Ag conductors were measured as a function of stripe width. Both the median lifetime and the standard deviation of the lognormal failure distribution were observed to depend strongly on the stripe width; this finding indicates that a narrower stripe is less reliable. This width dependence is interpreted in terms of the microstructural characteristics of the films.
Keywords
Chromium; Conductive films; Conductors; Electrical resistance measurement; Electromigration; Grain size; Integrated circuit reliability; Temperature; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1975.362689
Filename
4208070
Link To Document