Title :
Width Dependence of Electromigration Life in Al-Cu Al-Cu-Si, and Ag Conductors
Author :
Scoggan, G.A. ; Agarwala, B.N. ; Peressini, P.P. ; Brouillard, A.
Author_Institution :
IBM System Products Division, East Fishkill, Hopewell Junction, New York 12533
Abstract :
The electromigration lifetimes of thin-film Al-Cu, Al-Cu-Si, and Ag conductors were measured as a function of stripe width. Both the median lifetime and the standard deviation of the lognormal failure distribution were observed to depend strongly on the stripe width; this finding indicates that a narrower stripe is less reliable. This width dependence is interpreted in terms of the microstructural characteristics of the films.
Keywords :
Chromium; Conductive films; Conductors; Electrical resistance measurement; Electromigration; Grain size; Integrated circuit reliability; Temperature; Testing; Transistors;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362689
