• DocumentCode
    2605663
  • Title

    Impact of TiN Metal gate on NBTI assessed by interface states and fast transient effect characterization

  • Author

    Rafik, M. ; Garros, X. ; Ribes, G. ; Ghibaudo, G. ; Hobbs, C. ; Zauner, A. ; Muller, M. ; Huard, V. ; Ouvard, C.

  • Author_Institution
    STMicroelectronics, Crolles
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    825
  • Lastpage
    828
  • Abstract
    With the decrease of the high-k layer thickness, NBTI becomes more critical than PBTI. The relative contribution of interface states and trapping on NBTI is analysed in Hf-based stacks. Dit density and generation kinetics were found to be similar to that in SiO2, whereas a very large fast trapping component was evidenced. The pre-existing traps responsible for this fast trapping effect were related to N incorporation in the interfacial layer after TiN PVD deposition. Finally, a significant lifetime improvement is achieved using TaC as gate material.
  • Keywords
    MOSFET; hafnium; high-k dielectric thin films; hole traps; interface states; semiconductor device measurement; semiconductor device models; semiconductor device reliability; sputter deposition; tantalum compounds; thermal stability; thermal stresses; titanium compounds; transients; CMOS process; Hf-TiN; NBTI; PVD deposition; TaC; fast transient effect characterization; fast trapping component; gate material; hafium-based stacks; high-k layer thickness; interface states; interface trap density; interface trap generation kinetics; lifetime improvement; metal gate impact; Charge pumps; Degradation; Dielectric measurements; High K dielectric materials; High-K gate dielectrics; Interface states; Niobium compounds; Stress; Tin; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4419075
  • Filename
    4419075