Title :
Multilevel Substrate Technology and Epoxy Component Attach for Hybrid Fabrication
Author_Institution :
Teledyne Microelectronics, Los Angeles, Ca. 90066
Keywords :
Bars; Costs; Dielectric substrates; Fabrication; Ink; Integrated circuit interconnections; Integrated circuit technology; Testing; Thermal stresses; Thick films;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362699
