DocumentCode :
2605819
Title :
Packages and Film Resistors for Hybrid Microcircuits
Author :
Lane, Clyde H.
Author_Institution :
Rome Air Development Center, Griffiss AFB NY 13441
fYear :
1975
fDate :
27485
Firstpage :
230
Lastpage :
241
Abstract :
Resistors: A review of resistor systems, and the processes used to deposit and delineate them, is given. Effects of mechanical, thermal, chemical and electrical stresses are discussed as they relate to accuracy and stability. Failure mechanisms are reviewed. Triming techniques are explored and design limits for the various systems discussed. Parameters of interest such as frequency response, temperature coefficient, voltage coefficient and noise are compared for the various systems. Finally, quality control and screening techniques are discussed as they relate failure mechanisms and package quality and reliability control.
Keywords :
Chemicals; Failure analysis; Frequency response; Hybrid integrated circuits; Packaging; Resistors; Temperature; Thermal stability; Thermal stresses; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1975.362700
Filename :
4208081
Link To Document :
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