Title :
Repairs to Complex Hybrid Circuits - Their Effect on Reliability
Author :
Bertin, A.P. ; Terwilliger, T.W.
Author_Institution :
General Electric Company, Aircraft Equipment Division, Utica, New York
Keywords :
Assembly; Bonding; Circuit optimization; Circuit testing; History; Seals; Substrates; Temperature; Thin film circuits; Thin film transistors;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362701
