Title :
Practical Applications of Accelerated Testing - Introduction
Author_Institution :
Bell Telephone Laboratories, Incorporated Allentown, Pennsylvania 18103
Keywords :
Circuit testing; Degradation; Electromigration; Failure analysis; Life estimation; Metallization; Semiconductor devices; Silicon; Stress; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362703
