DocumentCode
2605906
Title
Stress-Induced Mobility Enhancement for Integrated Power Transistors
Author
Moens, P. ; Roig, J. ; Clemente, F. ; De Wolf, I. ; Desoete, B. ; Bauwens, F. ; Tack, M.
Author_Institution
AMI Semicond. Belgium BVBA, Oudenaarde
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
877
Lastpage
880
Abstract
It is for the first time shown that integrated power transistors can benefit from mobility enhancement due to strained silicon, an effect that is usually only reported for deep submicron CMOS. Experimental validation is done by mu-Raman spectroscopy (muRS) measurements on a transistor cross- section. The silicon stress is measured to be in the order of several hundreds of MPa, yielding a reduction in drift resistance (Ron) of approximately 20%. A novel theoretical model relating Ron to Vbd, and including stress-induced mobility enhancement, is provided.
Keywords
CMOS integrated circuits; Raman spectroscopy; carrier mobility; power transistors; semiconductor device models; silicon; stress effects; stress measurement; Si; deep submicron CMOS; drift resistance reduction; integrated power transistors; mu-Raman spectroscopy measurements; silicon stress measurement; stress-induced mobility enhancement; Ambient intelligence; CMOS process; Electrical resistance measurement; MOS capacitors; Power transistors; Silicon; Spectroscopy; Stress; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-1507-6
Electronic_ISBN
978-1-4244-1508-3
Type
conf
DOI
10.1109/IEDM.2007.4419089
Filename
4419089
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