Title :
Determination of Useful Life of Two-Layer Metallization Systems Via Accelerated Stressing
Author_Institution :
Lead Engineer, Harris Semiconductor, P. O. Box 883, Melbourne, Florida 32901
Keywords :
Acceleration; Aluminum; Contacts; Electromigration; Failure analysis; Life estimation; Metallization; Stress; Testing; Vehicles;
Conference_Titel :
Reliability Physics Symposium, 1975. 13th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1975.362707
