DocumentCode :
2606015
Title :
Microrobot-based nanoindentation of an epoxy-based electrically conductive adhesive
Author :
Mircea, Iulian ; Fatikow, Sergej ; Sill, Albert
Author_Institution :
Dept. of Comput. Sci., Oldenburg Univ., Oldenburg
fYear :
2007
fDate :
2-5 Aug. 2007
Firstpage :
719
Lastpage :
722
Abstract :
Microrobot-based nanoindentation is a relatively new testing technique, which uses microrobot based methods for performing nanoindentation experiments. The use of the microrobot-based nanoindentation is a example how microrobotic technology can help the materials research. In this work, the hardness of an epoxy-based silver-filled electrically conductive adhesive (ECA) type PC 3002 has been determined using this method. Flat ECA specimens have been investigated after a first curing at 70degC for 120 minutes, respectively after a curing time of 150 minutes, 180 minutes, 240 minutes, 300 minutes, and finally after 325 minutes at the same temperature. The maximum indentation depth was 1 mum. The hardness of the ECA has shown an increase with the increase of the curing time at constant temperature. The set-up uses a Berkovich diamond tip for performing nanoindentation tests. The set-up requires calibrations with reference specimens (fused silica and sapphire) for calculating hardness and Young´s modulus of the tested material. Preliminary results are very promising: by comparing the slope of the loading stage of the nanoindentation tests on different specimens, the difference in hardness can be qualitatively evidenced.
Keywords :
Young´s modulus; adhesives; calibration; curing; filled polymers; hardness; indentation; mechanical testing; nanotechnology; silver; Ag; Berkovich diamond tip; Young´s modulus; calibrations; curing; epoxy-based electrically conductive adhesive; hardness; indentation depth; microrobot-based nanoindentation; nanoindentation tests; silver filler; temperature 70 degC; time 120 min; time 150 min; time 180 min; time 240 min; time 300 min; time 325 min; Biological materials; Biomedical materials; Conducting materials; Conductive adhesives; Curing; Lead; Materials testing; Microelectronics; Performance evaluation; Polymers; electrically conductive adhesive; hardness; microelectronics; microrobotics; nanoindentation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-0607-4
Electronic_ISBN :
978-1-4244-0608-1
Type :
conf
DOI :
10.1109/NANO.2007.4601289
Filename :
4601289
Link To Document :
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