Title :
Microsurgery as a Tool in the Analysis of L.S.I. Silicon Chips
Author_Institution :
Bell-Northern Research, Box 3511, Station C, Ottawa, Ontario K1Y-4H7, Canada
Abstract :
The ability to open or bridge selected conductors on an L.S.I. chip opens up a wide range of analytical opportunities in the field of failure analysis, design debugging, and commercial device analysis. Simple methods of severing, repairing and interconnecting conductors in high density L.S.I. silicon chips are described. The design details of a simple precision tool serving the dual functions of microsurgery and subsequent electrical probing of components is discussed. Results obtained with the methods described on various commercial & custom L.S.I. circuits are presented.
Keywords :
Aluminum; Circuit testing; Conductors; Etching; Failure analysis; Integrated circuit interconnections; Microscopy; Microsurgery; Silicon; Surgery;
Conference_Titel :
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1976.362718
