• DocumentCode
    2606228
  • Title

    Accelerated Life Testing of Flexible Printed Circuits

  • Author

    Boddy, P.J. ; Delaney, R.H. ; Lahti, J.N. ; Landry, E.F. ; Restrick, R.C.

  • Author_Institution
    Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
  • fYear
    1976
  • fDate
    27851
  • Firstpage
    108
  • Lastpage
    117
  • Abstract
    Part I of this paper describes a facility which has recently been developed to conduct accelerated life tests on-printed wiring products. Procedures developed for the evaluation of flexible printed circuits are outlined, and a representative set of life test data is reviewed to illustrate the kinds of information obtainable with this facility. In conducting accelerated life tests on fineline flexible printed circuits coated with UV-cured resins, failures have been observed to occur in virtually every part of the circuit structure. In Part II, the various failure modes are described and are categorized according to the principal structural element involved (e.g., cover-coat, substrate, etc.). In many cases environmental domains have been identified, within which there is a clear predominance of a specific failure mode.
  • Keywords
    Circuit testing; Containers; Flexible printed circuits; Life estimation; Life testing; Resins; Space technology; Temperature distribution; Voltage; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1976. 14th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1976.362728
  • Filename
    4208112