DocumentCode
2606228
Title
Accelerated Life Testing of Flexible Printed Circuits
Author
Boddy, P.J. ; Delaney, R.H. ; Lahti, J.N. ; Landry, E.F. ; Restrick, R.C.
Author_Institution
Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
fYear
1976
fDate
27851
Firstpage
108
Lastpage
117
Abstract
Part I of this paper describes a facility which has recently been developed to conduct accelerated life tests on-printed wiring products. Procedures developed for the evaluation of flexible printed circuits are outlined, and a representative set of life test data is reviewed to illustrate the kinds of information obtainable with this facility. In conducting accelerated life tests on fineline flexible printed circuits coated with UV-cured resins, failures have been observed to occur in virtually every part of the circuit structure. In Part II, the various failure modes are described and are categorized according to the principal structural element involved (e.g., cover-coat, substrate, etc.). In many cases environmental domains have been identified, within which there is a clear predominance of a specific failure mode.
Keywords
Circuit testing; Containers; Flexible printed circuits; Life estimation; Life testing; Resins; Space technology; Temperature distribution; Voltage; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1976.362728
Filename
4208112
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