Title :
A Simple Model for the Thermo-Mechanical Deformations of Plated-Through-Holes in Multilayer Printed Wiring Boards
Author_Institution :
Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
Abstract :
A simple model is described which provides a basic understanding of the relationship between the thermo-mechanical deformations of a plated-through-hole and the consequent principal failure modes of the PTH structure. The model facilitates the design of effective reliability test programs and the interpretation of experimental results.
Keywords :
Capacitive sensors; Copper; Deformable models; Materials reliability; Nonhomogeneous media; Temperature; Thermal expansion; Thermal stresses; Thermomechanical processes; Wiring;
Conference_Titel :
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1976.362730
