Title :
Methods for Evaluating Plated-Through-Hole Reliability
Author_Institution :
Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
Abstract :
The principal thermo-mechanical failure modes of a plated-through-hole structure are described and the major factors contributing to such failures are discussed in mechanistic terms. This leads to the development of an improved methodology for evaluating the reliability of plated-through-holes.
Keywords :
Capacitive sensors; Circuit testing; Copper; Drilling; Manufacturing; Plastics; Soldering; Strain measurement; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1976.362731
