DocumentCode
2606298
Title
Measurement of Land to Plated-Through-Hole Interface Resistance in Multilayer Boards
Author
Hines, J.N.
Author_Institution
Bell Laboratories, Whippany, New Jersey 07981, (201) 386-3000
fYear
1976
fDate
27851
Firstpage
132
Lastpage
134
Abstract
Thermally induced cracks can occur at the interface between land and PTE barrel, hence, a measure of electrical continuity of the interface connection is important in product quality assessment and reliability projection. Series circuits with poor resolution are generally used to monitor circuit integrity during thermal tests. A much more sensitive method of measuring the interface directly is described.
Keywords
Circuit testing; Contact resistance; Current measurement; Electrical resistance measurement; Life testing; Nonhomogeneous media; Thermal resistance; Thermal stresses; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1976.362732
Filename
4208116
Link To Document