• DocumentCode
    2606311
  • Title

    Analysis of As, P Diffusion and Defect Evolution during Sub-millisecond Non-melt Laser Annealing based on an Atomistic Kinetic Monte Carlo Approach

  • Author

    Noda, T. ; Vandervorst, W. ; Felch, S. ; Parihar, V. ; Cuperus, A. ; Mcintosh, R. ; Vrancken, C. ; Rosseel, E. ; Bender, H. ; van Daele, B. ; Niwa, M. ; Umimoto, H. ; Schreutelkamp, R. ; Absil, P.P. ; Jurczak, M. ; De Meyer, K. ; Biesemans, S. ; Hoffmann,

  • Author_Institution
    Matsushita Electr. Ind. Co., Ltd., Kyoto
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    955
  • Lastpage
    958
  • Abstract
    n-type dopant diffusion during sub-millisecond (ms) non-melt laser annealing (NLA) is investigated through the experiments and atomistic KMC modeling. Laser-only annealing can improve the n-type dopant activation and achieve shallow junctions. KMC model with vacancy complexes indicates that laser-only annealing for nFET can achieve highly activated junctions and reduce dopant fluctuations in the channel region and that P is an attractive replacement for the As extension with laser-only anneal.
  • Keywords
    Monte Carlo methods; arsenic; diffusion; field effect transistors; interstitials; laser beam annealing; phosphorus; semiconductor device models; semiconductor doping; semiconductor junctions; vacancies (crystal); As; P; atomistic kinetic Monte Carlo approach; defect evolution; diffusion analysis; dopant fluctuations reduction; n-type dopant activation; n-type dopant diffusion; nFET; shallow junctions; sub-millisecond nonmelt laser annealing; vacancy complexes; Annealing; Atom lasers; Atomic beams; Atomic layer deposition; Kinetic theory; Laser modes; Monte Carlo methods; Optical materials; Semiconductor process modeling; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4419111
  • Filename
    4419111