DocumentCode :
2606358
Title :
Process Technology - Interconnect & 3D-IC´s
Author :
Iacoponi, John ; Hasegawa, Toshiaki
Author_Institution :
AMD
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
967
Lastpage :
967
Keywords :
Copper; Costs; Dielectrics; Hafnium oxide; MIM capacitors; Microassembly; National electric code; Packaging; Paper technology; Three-dimensional integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
Type :
conf
DOI :
10.1109/IEDM.2007.4419114
Filename :
4419114
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2606358
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