Title :
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
Abstract :
The following topics are dealt with: electrical and thermal design for high performance electronics; mechanical and reliability modeling; materials and assembly processes including lead free and halogen free materials; 3D packaging; MEMS and optical component packaging.
Keywords :
electronics packaging; 3D packaging; MEMS packaging; assembly processes; electrical design; electronics packaging; high performance electronics; mechanical modeling; optical component packaging; reliability modeling; thermal design; CD-ROMs; Chapters; Components, Packaging, and Manufacturing Technology Society; Electronics packaging; IEEE catalog; IEEE services; Libraries; Permission;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Conference_Location :
Singapore
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271479
