DocumentCode
2606462
Title
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
fYear
2003
fDate
12-12 Dec. 2003
Abstract
The following topics are dealt with: electrical and thermal design for high performance electronics; mechanical and reliability modeling; materials and assembly processes including lead free and halogen free materials; 3D packaging; MEMS and optical component packaging.
Keywords
electronics packaging; 3D packaging; MEMS packaging; assembly processes; electrical design; electronics packaging; high performance electronics; mechanical modeling; optical component packaging; reliability modeling; thermal design; CD-ROMs; Chapters; Components, Packaging, and Manufacturing Technology Society; Electronics packaging; IEEE catalog; IEEE services; Libraries; Permission;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Conference_Location
Singapore
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271479
Filename
1271479
Link To Document