Stackable packages with integrated components

Author

Ostmann, A. ; Neumann, A. ; Jung, E. ; Aschenbrenner, R. ; Reichl, H.

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration, Germany

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

19

Lastpage

23

Abstract

A technology for the integration of thin chips into build-up layers of organic substrates is under development. In order to improve the process, laser technology has been introduced for via drilling and interconnect structuring. Basic reliability tests of embedded chips were performed. For the realization of integrated resistors, the deposition of ultra-thin electroless Ni layers is used. Also here, laser ablation has been implemented for structuring. Finally, an improved and simplified concept for the realization of stackable chip packages is presented.

Keywords

electroless deposited coatings; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; laser ablation; laser beam machining; multichip modules; nickel; plastic packaging; thin film resistors; Ni; build-up layers; embedded chips; integrated components; integrated resistors; interconnect structuring; laser ablation; laser technology; organic substrates; reliability tests; stackable chip packages; thin chip integration; ultra-thin electroless Ni layers; via drilling; Dielectric losses; Integrated circuit technology; Laser ablation; Packaging; Polymers; Production; Radio frequency; Resistors; Space technology; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271483

Filename

1271483