Analytical model of power/ground noise coupling to signal traces in high-speed multi-layer packages or boards

Author

Kim, Jingook ; Rotaru, Mihai Dragos ; Lee, Junwoo ; Park, Jongbae ; Alexander, Popov ; Iyer, Mahadevan K. ; Joungho Kim

Author_Institution

Dept of EECS, KAIST, Daejon, South Korea

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

45

Lastpage

50

Abstract

This paper presents an analytical model of power/ground noise coupling to signal traces in high-speed multi-layer systems. The coupling model is expressed in terms of transfer impedance which denotes the coupled noise voltage at the signal trace when switching current occurs. This model is then compared with measured data and full-wave simulated data up to 10 GHz to verify the validity of the model. The results calculated by the proposed model shows good correlation with measurement.

Keywords

circuit noise; circuit simulation; high-speed integrated circuits; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; printed circuit testing; printed circuits; 10 GHz; analytical power/ground noise coupling model; coupled noise voltage; full-wave simulated data; high-speed multi-layer boards; high-speed multi-layer packages; measured data; model correlation; model validity; signal traces; switching current; transfer impedance; Analytical models; Circuit noise; Couplings; Electromagnetic fields; Integrated circuit interconnections; Packaging; Physics; Power system modeling; Signal generators; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271488

Filename

1271488