Title :
Microcircuit Package Gas Analysis
Author :
Thomas, Robert W.
Author_Institution :
ROME AIR DEVELOPMENT CENTER, GRIFFISS AFB NY 13441. (315)330-4632
Abstract :
A method for accurately measuring the ambient gas hermetically sealed within the cavity of micro-electronic package is described. Design consideration for the opening chamber are discussed. The type of mass spectrometer and its operation are detailed for those who might be selecting one as a detector. Finally, the pumping system and an automated data analysis system are considered in detail. Once assembled, the gas analysis system must be accurately calibrated. The various methods used for calibration are discussed, followed by section which relates the analysis results to the assembly and sealing of the microcircuit package.
Keywords :
Assembly systems; Circuits; Electronics packaging; Information analysis; Mass spectroscopy; Moisture; Steel; Temperature; Vacuum systems; Welding;
Conference_Titel :
Reliability Physics Symposium, 1976. 14th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1976.362755