Evaluation of the ultra thin multi die outline (Ulthimo) concept as a package for high frequency transistors

In electronic packaging for high frequency applications trends are miniaturisation (small footprint), optimised performance (low inductance leads), low cost, and mass fabrication potential. The so-called Ulthimo technology has been developed to meet these requirements. The construction being basically a moulded sandwich of a die clamped between a copper foil and connecting pads, it shows excellent high frequency properties and can be fabricated on matrix (plate size) level, yielding large numbers of packaged products from each processed plate.