A low cost leadless package concept

We report an innovative low cost leadless package concept with an ultra-miniaturized footprint and a significant height reduction. The package height has the potential to be made smaller than 0.4 mm. For discrete and low pin count solutions the package space can consume much less than 50% of present available standard packages. The package fulfills the typical first and second level reliability tests which include temperature cycling, pressure cooker or drop tests for low pin count solutions < 10 pins. We show results that the small and short contact pins lead to an excellent RF performance. The package is not only highly attractive for the discrete market, it also has remarkable potential for medium pin-count solutions. The package is capable for wireless and wireline solutions.