Title :
Decapsulation of Epoxy Devices using Oxygen Plasma
Author :
Wilson, D.D. ; Beall, J.R.
Author_Institution :
Martin Marietta Corporation, Denver, Colorado 80201. (303) 979-7000
Keywords :
Etching; Failure analysis; Fluid flow; Oxygen; Plasma applications; Plasma chemistry; Plasma devices; Radio frequency; Semiconductor device packaging; Testing;
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
DOI :
10.1109/IRPS.1977.362775