DocumentCode :
2606961
Title :
Decapsulation of Epoxy Devices using Oxygen Plasma
Author :
Wilson, D.D. ; Beall, J.R.
Author_Institution :
Martin Marietta Corporation, Denver, Colorado 80201. (303) 979-7000
fYear :
1977
fDate :
28216
Firstpage :
82
Lastpage :
84
Keywords :
Etching; Failure analysis; Fluid flow; Oxygen; Plasma applications; Plasma chemistry; Plasma devices; Radio frequency; Semiconductor device packaging; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1977.362775
Filename :
4208162
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2606961
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