DocumentCode

2606961

Title

Decapsulation of Epoxy Devices using Oxygen Plasma

Author

Wilson, D.D. ; Beall, J.R.

Author_Institution

Martin Marietta Corporation, Denver, Colorado 80201. (303) 979-7000

fYear

1977

fDate

28216

Firstpage

82

Lastpage

84

Keywords

Etching; Failure analysis; Fluid flow; Oxygen; Plasma applications; Plasma chemistry; Plasma devices; Radio frequency; Semiconductor device packaging; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1977. 15th Annual

Conference_Location

LAs Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1977.362775

Filename

4208162