DocumentCode
2606978
Title
A New Moisture Sensor for "In-Situ" Monitoring of Sealed Packages
Author
Kovac, Michael G. ; Chleck, David ; Goodman, Philip
Author_Institution
Panametrics, Inc., Waltham, MA 02154. (617)899-2719); Department of E.E., University of South Florida, Tampa, Florida.
fYear
1977
fDate
28216
Firstpage
85
Lastpage
91
Abstract
A new Al2O3 moisture sensor fabricated on an oxidized silicon wafer is described. The sensor responds to moisture levels down to 1 ppmv and is used to nondestructively determine the water level inside sealed hybrid packages. Device performance characteristics are given. Preliminary results are reported for these devices sealed in hybrid packages at several manufacturing locations.
Keywords
Current measurement; Failure analysis; Gold; Mass spectroscopy; Microelectronics; Moisture measurement; Monitoring; Semiconductor device packaging; Sensor phenomena and characterization; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location
LAs Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1977.362776
Filename
4208163
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