Title :
A New Moisture Sensor for "In-Situ" Monitoring of Sealed Packages
Author :
Kovac, Michael G. ; Chleck, David ; Goodman, Philip
Author_Institution :
Panametrics, Inc., Waltham, MA 02154. (617)899-2719); Department of E.E., University of South Florida, Tampa, Florida.
Abstract :
A new Al2O3 moisture sensor fabricated on an oxidized silicon wafer is described. The sensor responds to moisture levels down to 1 ppmv and is used to nondestructively determine the water level inside sealed hybrid packages. Device performance characteristics are given. Preliminary results are reported for these devices sealed in hybrid packages at several manufacturing locations.
Keywords :
Current measurement; Failure analysis; Gold; Mass spectroscopy; Microelectronics; Moisture measurement; Monitoring; Semiconductor device packaging; Sensor phenomena and characterization; Temperature sensors;
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
DOI :
10.1109/IRPS.1977.362776
