On the Penetration of Gases and Water Vapour into Packages with Cavities and on Maximum Allowable Leak Rates

Electrolytic corrosion of aluminium interconnection lines on low power integrated circuit chips is a critical failure mechanism during longlife applications. Theoretical analysis and experimental investigations show that the maximum allowable leak rates specified in the MIL STD 883A are insufficient for such components. A helium leak rate of 10¿10 atm cm3s¿1 (V 0.1 cm3, method 1014.1) should be required as well as a dry atmosphere during sealing of packages.