DocumentCode :
2607053
Title :
Effects of Burn-In and Temperature Cycling on the Corrosion Resistance of Plastic Encapsulated Integrated Circuits
Author :
Bailey, C.M.
Author_Institution :
Bell Telephone Laboratories, 555 Union Boulevard, Allentown, Pennsylvania 18103. (215) 439-6140
fYear :
1977
fDate :
28216
Firstpage :
120
Lastpage :
124
Abstract :
Plastic-encapsulated integrated circuits are susceptible to failures due to moisture-related corrosion of aluminum metallization. A test program has been conducted to evaluate the possible effects of 100% burn-in and temperature cycling device screens in increasing that susceptibility. Results indicate no significant effects.
Keywords :
Aluminum; Bonding; Circuit testing; Corrosion; Glass; Integrated circuit metallization; Moisture; Packaging; Plastics; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1977. 15th Annual
Conference_Location :
LAs Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1977.362781
Filename :
4208168
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2607053
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