DocumentCode
2607512
Title
Flip chip assembly of MEMS inductors
Author
Pang, A.J. ; Wang, C.H. ; Sangster, A.J.
Author_Institution
Dept. of Electr., Electron. & Comput. Eng., Heriot-Watt Univ., Edinburgh, UK
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
298
Lastpage
300
Abstract
In this paper, we describe the fabrication, assembly and RF characterisation of suspended MEMS inductors. The devices were fabricated on a carrier and then transferred onto the target substrate using a flip chip assembly and a carrier release technique. Suspended meander and spiral inductors have been successfully realised on glass substrates with an air gap of about 26 μm above the substrate surface. Initial RF measurements show a peak-Q value of about 30 at ∼ 6 GHz for a meander device, the corresponding inductance is about 1.5 nH.
Keywords
Q-factor; flip-chip devices; inductors; microassembling; micromechanical devices; 26 micron; 6 GHz; MEMS inductors; carrier release technique; glass substrate air gap; inductor flip chip assembly; meander inductors; off-chip inductors; peak-Q value; spiral inductors; suspended inductors; Assembly; Fabrication; Flip chip; Glass; Inductance measurement; Inductors; Micromechanical devices; Radio frequency; Semiconductor device measurement; Spirals;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271533
Filename
1271533
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