MEMS vacuum packaging technology and applications

Author

Jin, Y. ; Wang, Z.F. ; Lim, P.C. ; Pan, D.Y. ; Wei, J. ; Wong, J. Wei C K

Author_Institution

Singapore Inst. of Manuf. Technol., Singapore

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

301

Lastpage

306

Abstract

Vacuum packaging is essential for various kinds of microelectromechanical system (MEMS) devices for enhancing the performance and reliability. This paper presents our works on research on vacuum packaging of MEMS devices. A hermetical sealing technique has been developed, which involves the processes of anodic bonding for silicon and glass wafers with imperfect interface, adhesive bonding, glass frit bonding and silicon-to-gold eutectic bonding. Vacuum maintenance has been achieved by applying evaporable and nonevaporable getter films in the packaging process. A specific helium leak detector with bombing system is introduced, which can monitor the deformation of micro diaphragms and conduct leak detection for MEMS structures.

Keywords

electronics packaging; getters; hermetic seals; leak detection; micromechanical devices; wafer bonding; He; MEMS vacuum packaging technology; Si-Au; adhesive bonding; anodic bonding; eutectic bonding; evaporable getter films; glass frit bonding; helium bombing system; helium leak detector; hermetic sealing; leak detection; micro diaphragm deformation; microelectromechanical system devices; nonevaporable getter films; reliability; silicon/glass wafers; vacuum maintenance; Glass; Leak detection; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Packaging; Silicon; Vacuum systems; Vacuum technology; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271534

Filename

1271534