DocumentCode :
2607587
Title :
Electrical Overstress Failure Analysis in Microcircuits
Author :
Smith, J.S.
Author_Institution :
Lockheed Palo Alto Research Laboratory, Palo Alto, CA 94304
fYear :
1978
fDate :
28581
Firstpage :
41
Lastpage :
46
Keywords :
Aluminum; Contacts; Earth Observing System; Electric resistance; Failure analysis; Metallization; Power dissipation; Silicon; Temperature; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1978.362816
Filename :
4208206
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2607587
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