Capillary underfill and mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate

Author

Kooi, Chee Choong ; Shing, Lim Szu ; Periaman, Shanggar ; Chui, Jane ; Then, Edward ; Huat, Ng Cheong ; Fai, Low Mun

Author_Institution

Intel Technol., Penang, Malaysia

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

324

Lastpage

330

Abstract

This paper discusses the work on capillary underfill and mold technology to assemble exposed die backside Flip Chip Molded Matrix Array. Parts were successfully assembled and subjected to reliability stress test. The interaction between capillary underfill and mold compound materials are crucial for assembly and reliability performances of this configuration. Both materials need to be chemically and physically compatible to achieve high reliability performance.

Keywords

ball grid arrays; chip scale packaging; encapsulation; flip-chip devices; heat sinks; integrated circuit reliability; reflow soldering; thermal management (packaging); transfer moulding; capillary underfill; compatibility; exposed die backside configuration; exposed die flip chip molded matrix array; heat sink; low stress process; matrix array package; moisture soaking; mold encapsulation materials; reflow; reliability stress test; thin substrate; Assembly; Chemicals; Dielectric materials; Encapsulation; Flip chip; Materials reliability; Organic materials; Packaging; Stress; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271539

Filename

1271539