Title :
Determination of Strain in 10μm Spots using a Microdiffractometer
Author :
Walker, G.A. ; Goldsmith, C.C.
Author_Institution :
IBM System Products Division, East Fishkill, Hopewell Junction, New York 12533
Abstract :
High strain fields in composite structures can cause failure due to cracking of ceramic or Si or peeling of thin films. With the trend toward smaller devices/packages, geometry effects play a role through stress concentration, and it is therefore, necessary to measure strain in small areas. Examples of strain measurement on test samples from lO¿m spots, using an X-ray microdiffractometer, are given and the technique is described.
Keywords :
Area measurement; Capacitive sensors; Optical films; Optical microscopy; Packaging; Radiation detectors; Strain measurement; Stress measurement; Transistors; X-ray diffraction;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362818
