DocumentCode
2607751
Title
A time-domain-reflectometry characterization technique for packaging substrates
Author
Chun, Deng ; Ang, Simon S. ; Chai, Tai Chong ; Tay, Andrew A O
Author_Institution
Nano/Microsystems Integration Lab., Nat. Univ. of Singapore, Singapore
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
361
Lastpage
365
Abstract
A Time-Domain-Reflectometry (TDR) characterization technique has been investigated to enhance the detection of discontinuities in packaging and PCB structures. Three groups of test vehicles have been fabricated, on which special features were purposely introduced. From the locations of these special test features, the detection of discontinuities was improved significantly.
Keywords
electronics packaging; failure analysis; microwave reflectometry; printed circuit testing; substrates; time-domain reflectometry; PCB structures; characteristic impedance; discontinuities detection; failure analysis; four-via test vehicle; packaging substrates; signal transmission lines; step voltage; time-domain-reflectometry characterization technique; Conductors; Copper; Electronics packaging; Impedance; Integrated circuit interconnections; Microelectronics; Signal resolution; Testing; Vehicles; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN
0-7803-8205-6
Type
conf
DOI
10.1109/EPTC.2003.1271546
Filename
1271546
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