Title :
A time-domain-reflectometry characterization technique for packaging substrates
Author :
Chun, Deng ; Ang, Simon S. ; Chai, Tai Chong ; Tay, Andrew A O
Author_Institution :
Nano/Microsystems Integration Lab., Nat. Univ. of Singapore, Singapore
Abstract :
A Time-Domain-Reflectometry (TDR) characterization technique has been investigated to enhance the detection of discontinuities in packaging and PCB structures. Three groups of test vehicles have been fabricated, on which special features were purposely introduced. From the locations of these special test features, the detection of discontinuities was improved significantly.
Keywords :
electronics packaging; failure analysis; microwave reflectometry; printed circuit testing; substrates; time-domain reflectometry; PCB structures; characteristic impedance; discontinuities detection; failure analysis; four-via test vehicle; packaging substrates; signal transmission lines; step voltage; time-domain-reflectometry characterization technique; Conductors; Copper; Electronics packaging; Impedance; Integrated circuit interconnections; Microelectronics; Signal resolution; Testing; Vehicles; Voltage;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271546
