DocumentCode :
2607769
Title :
Wire bond causes electrical overstress [BGA package example]
Author :
Tan, SH ; Kang, Clara AY ; Ong, SH
Author_Institution :
Nat. Semicond. Manufacturer Singapore Pte Ltd., Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
366
Lastpage :
368
Abstract :
Electrical overstress causing burnt/melt metallization is a common failure in microelectronics circuits. It can occur in the manufacturing process or at the end user. For this type of failure, most of the times, it is due to the transient voltage or surge in current spiking at the auto test equipment (ATE) or test handler grounding. It could also be a faulty application at the customer. To nail down the problem, we need to investigate the whole manufacturing process from assembly to the final electrical testing of the devices. In this paper, the failing device was an enhanced plastic ball gate array (EPBGA) package with about 500 bonding wires. We isolated the culprit to the wire bond process via a problem solving methodology and experimental final verification.
Keywords :
ball grid arrays; electrostatic discharge; failure analysis; integrated circuit manufacture; integrated circuit metallisation; lead bonding; plastic packaging; ATE transient voltage; BGA package; EPBGA; assembly; bonding wires; burnt metallization; current spiking surge; electrical overstress; enhanced plastic ball gate array; final electrical testing; manufacturing process; melted metallization; microelectronics circuit failure; test handler grounding; wire bond process; Bonding; Circuits; Manufacturing processes; Metallization; Microelectronics; Packaging; Surges; Test equipment; Voltage; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
Type :
conf
DOI :
10.1109/EPTC.2003.1271547
Filename :
1271547
Link To Document :
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