Title :
Resistance characterization of flip chip joint formed using Au bumps and anisotropic conductive adhesives
Author :
Lee, Charles ; Yeo, Alfred
Author_Institution :
Assembly & Interconnect Technol., Infineon Technol. Asia Pacific Pte Ltd., Singapore, Singapore
Abstract :
In this paper, the resistance characterization of flip chip joints formed using Au bumps and anisotropic conductive adhesives (ACAs) is reported. A flip chip on glass (FCOG) test vehicle with indium tin oxide (ITO) conductive lines was used to study the effect of Au bump structure, bonding forces, bump size, conductive filler size and conductive filler loading on contact resistance. Both anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) with varying filler sizes and filler loadings were used to assemble the FCOG test vehicle. Joint contact resistances were obtained by a 4-point measurement method. Results showed that ACP joints generally requires an order of magnitude lower bonding force than ACF joints to achieve consistent contact resistance values. Uncoined Au bumps are preferred for ACF and ACP joints because they offer lower contact resistance than coined Au bumps. This work has led to a better understanding of contact resistance in ACF and ACP joints.
Keywords :
adhesive bonding; contact resistance; flip-chip devices; gold; indium compounds; tin compounds; ACF joints; ACP joints; FCOG; ITO conductive lines; ITO-Au; InSnO-Au; anisotropic conductive adhesives; anisotropic conductive film; anisotropic conductive paste; bonding forces; bump size; conductive filler loading; conductive filler size; contact resistance; flip chip joint resistance characterization; flip chip on glass; gold bump structure; Anisotropic magnetoresistance; Bonding forces; Conductive adhesives; Contact resistance; Flip chip; Glass; Gold; Indium tin oxide; Testing; Vehicles;
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
DOI :
10.1109/EPTC.2003.1271548