DocumentCode :
2607855
Title :
Development of solder replacement flip chip using anisotropic conductive adhesives
Author :
Min, Tan Ai ; Lim, Sharon Pei-Siang ; Lee, Charles
Author_Institution :
Assembly & Interconnect Technol., Infineon Technol. Asia Pacific Pte. Ltd., Singapore, Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
390
Lastpage :
396
Abstract :
With the continual drive towards package miniaturization, flip chip assembly using anisotropic conductive adhesives (ACAs) is fast emerging as one of the potential interconnect technology solutions in the fine pitch application space. In this paper, we report the process development of solder replacement flip chip at 120/240μm bump pitch using ACAs for mid I/O applications. Optimized ACA cure profiles were derived based on die shear test results. The cure time for anisotropic conductive paste (ACP) was found to be 2× longer than anisotropic conductive film (ACF) to achieve the same die shear strength for a given curing condition. Prolonged curing at 220°C was found to enhance the die shear strength. Consistent resistance reading was used as a criterion for ACA bond force selection. Generally, uncoined Au bumps was found to have lower and more stable resistance due to contact between the Au bump and substrate pad. As compared to unfilled ACF, silica filled ACP exhibited better contact resistance stability during temperature cycling (TC) and temperature humidity (TH) tests.
Keywords :
adhesives; chip-on-board packaging; contact resistance; curing; fine-pitch technology; flip-chip devices; shear strength; thermal management (packaging); thermal stability; 220 C; anisotropic conductive adhesives; contact resistance stability; cure profiles; die shear test; fine pitch; flip chip on board; package miniaturization; solder replacement flip chip; temperature cycling tests; temperature humidity tests; uncoined bumps; Anisotropic magnetoresistance; Conductive adhesives; Contact resistance; Curing; Flip chip; Gold; Packaging; Space technology; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
Type :
conf
DOI :
10.1109/EPTC.2003.1271552
Filename :
1271552
Link To Document :
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