Title :
Tape Assembled Components a Packaging Option
Author_Institution :
Components Group, Texas Instruments Incorporated, Stafford, Texas 77477
Abstract :
Integrated circuit chips bonded to flexible tape first found widespread volume application in semiconductor operations for the manufacture of 14/16 pin dual-in-line plastic packages. Components on tape are now being adopted by manufacturers of equipment and systems to achieve greater component density and improve throughput for assembly of electronic modules. Novel packaging techniques are appearing as both semiconductor manufacturers and end users better understand this technology.
Keywords :
Application specific integrated circuits; Assembly; Bonding; Electronic equipment manufacture; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362833
