DocumentCode
2607860
Title
Tape Assembled Components a Packaging Option
Author
Fritz, Galen F.
Author_Institution
Components Group, Texas Instruments Incorporated, Stafford, Texas 77477
fYear
1978
fDate
28581
Firstpage
124
Lastpage
126
Abstract
Integrated circuit chips bonded to flexible tape first found widespread volume application in semiconductor operations for the manufacture of 14/16 pin dual-in-line plastic packages. Components on tape are now being adopted by manufacturers of equipment and systems to achieve greater component density and improve throughput for assembly of electronic modules. Novel packaging techniques are appearing as both semiconductor manufacturers and end users better understand this technology.
Keywords
Application specific integrated circuits; Assembly; Bonding; Electronic equipment manufacture; Electronics packaging; Integrated circuit manufacture; Integrated circuit packaging; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1978.362833
Filename
4208223
Link To Document