مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2607876

Title :

Trends in Packaging Technology

Author :

Gedney, Ronald W.

Author_Institution :

IBM Corporation, Endicott, New York 13760. (607) 755-2000

fYear :

1978

fDate :

28581

Firstpage :

127

Lastpage :

129

Keywords :

Chip scale packaging; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit reliability; Large scale integration; Pins; Production; Semiconductor device packaging; Substrates;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Reliability Physics Symposium, 1978. 16th Annual

Conference_Location :

San Diego, CA, USA

ISSN :

0735-0791

Type :

conf

DOI :

10.1109/IRPS.1978.362834

Filename :

4208224

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2607876