DocumentCode
2607876
Title
Trends in Packaging Technology
Author
Gedney, Ronald W.
Author_Institution
IBM Corporation, Endicott, New York 13760. (607) 755-2000
fYear
1978
fDate
28581
Firstpage
127
Lastpage
129
Keywords
Chip scale packaging; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit reliability; Large scale integration; Pins; Production; Semiconductor device packaging; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1978.362834
Filename
4208224
Link To Document