• DocumentCode
    2607903
  • Title

    Advances in Ceramic Chip Carriers and Multilayer Substrate Technologies

  • Author

    Wade, Jim F.

  • Author_Institution
    3M Company, Electronic Products Division, St. Paul, Minnesota 55101
  • fYear
    1978
  • fDate
    28581
  • Firstpage
    130
  • Lastpage
    131
  • Abstract
    Multilayer ceramic packages are produced by co-firing layers of alumina tape and refractory metal into a monolithic structure. This processing technique has been used to produce millions of dual-in-line packages. The versatility of the system permits a number of different packaging approaches to be used. It offers the advantage of no glass interface for high reliability and maximum hermeticity. Small ceramic chip carriers are being manufactured now to house uartz crystals where leak rates of less than 10¿14 cc of He/second are achieved.
  • Keywords
    Ceramics; Costs; Electronics packaging; Heat sinks; Integrated circuit interconnections; Large scale integration; Lead; Manufacturing; Nonhomogeneous media; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1978. 16th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1978.362835
  • Filename
    4208225
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2607903