DocumentCode :
2607966
Title :
Electrical characterization of a high performance microprocessor socket for system level simulation
Author :
Rotaru, Mihai D. ; Weng, Wong Wui
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
415
Lastpage :
420
Abstract :
In this paper a novel electrical characterization methodology through measurement of a surface mount microprocessor socket is described. The measurement technique described here uses a de-embedding process and special test fixtures that ensures the extraction of the correct parasitic values of the socket pins. The measurements on the socket have been done in a very wide frequency bandwidth (45MHz to 10GHz) and the extraction of the equivalent circuits for the pins of the socket is presented in this work. The models have been successfully integrated and verified in a system level simulation, where the socket model has been integrated with a package model and a board model.
Keywords :
S-parameters; electric connectors; equivalent circuits; microprocessor chips; network analysers; surface mount technology; two-port networks; 45 MHz to 10 GHz; board model; de-embedding process; direct two port measurement; electrical characterization methodology; equivalent circuits; high performance microprocessor socket; package model; parasitic values; scattering parameters; socket pins; surface mount microprocessor socket; system level simulation; test fixtures; vector network analyzer; very wide frequency bandwidth; Bandwidth; Circuit testing; Electric variables measurement; Fixtures; Frequency measurement; Integrated circuit measurements; Measurement techniques; Microprocessors; Pins; Sockets;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)
Print_ISBN :
0-7803-8205-6
Type :
conf
DOI :
10.1109/EPTC.2003.1271557
Filename :
1271557
Link To Document :
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