Title :
VMOS Electrostatic Protection
Author :
Bhatti, I.S. ; Fuller, E. ; Jenne, F.B.
Author_Institution :
American Microsystems, Inc., 3800 Homestead Road, Santa Clara, CA 95051. (408) 246-0330
Abstract :
Present state of the art MOS devices with 1000 Ã
thick gate oxides have breakdown voltages in the 60-80 volts range. VMOS devices with the same oxide thickness have lower breakdown voltages (25-30 volts) due to higher fields in the oxide at the bottom of the V-groove. A VMOS protection device with higher protection capability than conventional MOS protection devices has been designed and tested. It consists of a poly resistor connected to an nipn diode, followed by an implanted n+ diffusion which acts as a distributed R C network attenuating tihe input voltage spikes. The final section consists of a planar NMOS transistor connected between the n+ diffusion and the VMOS gate. Tests show that this type of protection device is superior to conventional protection devices.
Keywords :
Breakdown voltage; Diodes; Electrostatics; Epitaxial layers; MOS devices; MOSFETs; Protection; Resistors; Substrates; Testing;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362838