Title :
New Acceleration Factors for Temperature, Humidity, Bias Testing
Author :
Sbar, N.L. ; Kozakiewicz, R.P.
Author_Institution :
Bell Telephone Laboratories, Incorporated, Allentown, Pennsylvania 18103
Abstract :
New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high stress laboratory environment to device life in a normal use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.
Keywords :
Acceleration; Circuit testing; Conductors; Humidity; Insulation life; Life estimation; Metallization; Silicon; Stress; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362842