• DocumentCode
    2608028
  • Title

    New Acceleration Factors for Temperature, Humidity, Bias Testing

  • Author

    Sbar, N.L. ; Kozakiewicz, R.P.

  • Author_Institution
    Bell Telephone Laboratories, Incorporated, Allentown, Pennsylvania 18103
  • fYear
    1978
  • fDate
    28581
  • Firstpage
    161
  • Lastpage
    178
  • Abstract
    New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high stress laboratory environment to device life in a normal use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.
  • Keywords
    Acceleration; Circuit testing; Conductors; Humidity; Insulation life; Life estimation; Metallization; Silicon; Stress; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1978. 16th Annual
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1978.362842
  • Filename
    4208232