DocumentCode
2608028
Title
New Acceleration Factors for Temperature, Humidity, Bias Testing
Author
Sbar, N.L. ; Kozakiewicz, R.P.
Author_Institution
Bell Telephone Laboratories, Incorporated, Allentown, Pennsylvania 18103
fYear
1978
fDate
28581
Firstpage
161
Lastpage
178
Abstract
New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high stress laboratory environment to device life in a normal use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.
Keywords
Acceleration; Circuit testing; Conductors; Humidity; Insulation life; Life estimation; Metallization; Silicon; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1978.362842
Filename
4208232
Link To Document