Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement

Author

Modi, Mitul B. ; Sitaraman, Suresh K.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

456

Lastpage

461

Abstract

We have developed a test method, called the Single-Substrate Decohesion Test (SSDT), to measure the interfacial fracture toughness for thin-film interfaces used in microelectronic applications. SSDT can be used to measure the interfacial fracture toughness over a range of mode mixity. In this work the results of the measurement of the full mode mixity versus interfacial fracture toughness curve for a submicron physical vapor deposited titanium thin film on a silicon substrate using SSDT are presented.

Keywords

adhesion; adhesives; delamination; fracture toughness testing; metallic thin films; silicon; titanium; Ti-Si; adhesive layers; curling; delamination; energy release rate; full mode mixity; interfacial fracture toughness measurement; microelectronic applications; physical vapor deposited titanium film; silicon substrate; single-substrate decohesion test; thin-film interfaces; Delamination; Mechanical variables measurement; Microelectronics; Packaging; Silicon; Substrates; Surface cracks; Testing; Titanium; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology, 2003 5th Conference (EPTC 2003)

Print_ISBN

0-7803-8205-6

Type

conf

DOI

10.1109/EPTC.2003.1271565

Filename

1271565