Title :
A Reliable Dry Ceramic Dual In-Line Package (CERDIP)
Author :
Lowry, R.K. ; Van Leeuwen, C.J. ; Kennimer, B.L. ; Miller, L.A.
Author_Institution :
Harris Semiconductor, P. O. Box 883, Melbourne, Florida 32901
Abstract :
The ceramic DIP package utilizing low temperature (~500°C) sealing glasses has been simultaneously widely deployed for packaging IC´s and condemned for many high reliability applications because of high, moisture content in the sealed cavity. This paper describes the construction, characteristics, and reliability performance of a volume producible, cost-effective Cerdip which has a sealed moisture content typically less than 500ppmv.
Keywords :
Ceramics; Corrosion; Crystalline materials; Crystallization; Glass; Metallization; Moisture; Semiconductor device packaging; Temperature; Viscosity;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362847
