Title :
Accelerated Reliability Evaluation of Trimetal Integrated Circuit Chips in Plastic Packages
Author :
Gallace, L.J. ; Khajezadeh, H.J. ; Rose, A.S.
Author_Institution :
RCA Solid State Division, Somerville, N. J. 08876. 201-685-6081
Abstract :
Accelerated step stress and constant-stress reliability tests have been performed on trimetal MOS and bipolar IC chips wire-and-beam-tape bonded in both plastic and hermetic packages. A failure mechanism related to a high-temperature chemical reaction between the epoxy molding compound and the materials of the device support structure was identified and a solution provided.
Keywords :
Acceleration; Bipolar integrated circuits; Bonding; Circuit testing; Integrated circuit reliability; Integrated circuit testing; Life estimation; Performance evaluation; Plastic integrated circuit packaging; Stress;
Conference_Titel :
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1978.362850
