DocumentCode
2608173
Title
Accelerated Reliability Evaluation of Trimetal Integrated Circuit Chips in Plastic Packages
Author
Gallace, L.J. ; Khajezadeh, H.J. ; Rose, A.S.
Author_Institution
RCA Solid State Division, Somerville, N. J. 08876. 201-685-6081
fYear
1978
fDate
28581
Firstpage
224
Lastpage
228
Abstract
Accelerated step stress and constant-stress reliability tests have been performed on trimetal MOS and bipolar IC chips wire-and-beam-tape bonded in both plastic and hermetic packages. A failure mechanism related to a high-temperature chemical reaction between the epoxy molding compound and the materials of the device support structure was identified and a solution provided.
Keywords
Acceleration; Bipolar integrated circuits; Bonding; Circuit testing; Integrated circuit reliability; Integrated circuit testing; Life estimation; Performance evaluation; Plastic integrated circuit packaging; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1978. 16th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1978.362850
Filename
4208240
Link To Document