A comprehensive study in thermal dissipation assessment of MPM-FCBGA

By integrating the MPM (multi package module) and flip chip (FC) technologies together, the MPM-FCBGA package can increase performance and allow miniaturization. This also offers a lower-cost solution for customers who desire SoC (system on-a-chip)-like qualities in their IC packages. However, the more functionality integrated in MPM-FCBGA leads to the extreme increase in package power density, which becomes a main challenge for package designers. A successful MPM-FCBGA development to fulfill customer demands is highly related to a state-of-the-art thermal characteristic analysis. This paper investigates several thermal such like as heat spreader (HS) types, heat spreader materials (copper and aluminum alloy), substrate materials (BT and ceramic) and PCB design with cavity to allow thermal gel filled connecting of the FC and ground plane. All analyses were conducted by numerical analyses utilizing a commercial finite differential analysis (FDA) program, Flotherm. Finally, the advanced PCB design with cavity achieved greatest benefit with 12% reduction in FC junction temperature.